Global Semiconductor Wafer Cleaning Market was valued at $13.4 Billion in 2015 and is estimated to grow at a CAGR of over 4% from 2016 to 2024.
Superior quality of wafer surface is an essential requisite for suitable fabrication of ULSI and VLSI circuits. Existence of undesirable materials or particles during the semiconductor wafer manufacturing process, results in deprivation of product quality. These contaminations are removed with effective use of semiconductor wafer cleaning systems.
The global semiconductor wafer cleaning market is witnessing increasing demand for fabrication products on account of escalating electronic production. The elevating need for enhanced quality products and the simplicity of fabricating pure wafers for integration processes are significantly resulting in mounting demand for sophisticated semiconductor wafer cleaning equipment and technologies.
Global Semiconductor Wafer Cleaning Market, By Region, 2014 – 2024 (USD Billion)
Increasing emphasis on achieving enhanced functionality along with high performance and low power from the chips is considerable resulting in the development of finer circuit patterns in semiconductors. Additionally, escalating use of 3D structures has led to definite changes in the chip demographics such as surge in the number of interconnect layers, improved device fabrication technologies, and use of diverse materials.
Rapid growth of the semiconductor industry worldwide is anticipated to be the primary factor driving the global semiconductor wafer cleaning market growth significantly over the forecast period. The industry is also witnessing elevating demand across varied applications including sensor devices, consumer electronic devices, memory devices and communication.
Asia Pacific accounted for the majority market share in the global semiconductor wafer cleaning market in 2015 and is also estimated to emerge as the fastest growing regional market over the next few years. This is ascribed to the snowballing output of electronic industry in line up paired with the augmenting semiconductor production in the region. Growing number of SMEs in countries such as Taiwan, Thailand, China, and India is expected to the major factor driving the regional market growth over the coming years.
“Optimal Price Point (OPP) for Semiconductor Wafer Cleaning Market”
Estimated Average solution cost – $ xx globally. However, with increasing local manufacturing, growing solution implementation and increasing SMEs, OPP and range of acceptable Prices (RAP) are going to change. We at Ameri Research continuously track these prices with our proprietary pricing model.
“Mounting demand for hand-held consumer electronic devices to propel industry growth”
Miniaturization of microelectronic devices paired with improvement in materials used in semiconductor manufacturing process is significantly driving the semiconductor wafer cleaning equipment demand. The industry is observing the need for higher production yield which is also anticipated to catapult equipment demand over the coming years.
“Falcon, Sony Semiconductor and Modutek collectively account for majority market share”
Snowballing automation in industries and factories along with evolving customer preference towards aesthetics of consumer and electronics products has significantly instigated manufacturers to continuously evolve and produce quality output. Use of semiconductor wafer cleaning systems in electronics production results in low bargaining power of component manufacturer over the system suppliers. Some of the other prominent industry players include Dainippon Screen Mfg. Co., Ltd, MEI Wet Processing Systems and Services LLC, Cleaning Technologies Group, Tokyo Electron Limited, Lam Research Corporation, and Akrion Systems LLC.
The primary method of fabrication used in the semiconductor wafer cleaning industry is known as RCA Standard Clean. Leading industry participants continuously research and invest in R&D to innovate and improve the fabrication process. As a result, the industry is witnessing increasing implementation of optimized equipment such as megasonic techniques, centrifugal spraying, and enclosed system processing that permits instantaneous removal of both contaminant particles and films.